羅杰斯(Rogers)公司Advanced Circuit Materials(ACM)部門即將在2009年1月19日至20日美國圣地亞哥舉辦的IEEE Radio & Wireless Symposium上，展出其最新的RT/duroid 高頻材料和RO3000/RO4000層壓板。

即將展出的RT/duroid材料包括RT/duroid 5000和RT/duroid 6002、以及最新的RT/duroid系列高頻材料(RT/duroid 6202PR)，它主要用于設計復雜的微波結構，如天線和需要層間互連的多層電路。

RT/duroid 6202PR可提供與RT/duroid 6202相同的電氣和機械性能，此外，當覆蓋一層阻性銅箔時，它還能用作容差很小的平面電阻。

其他展示的產品將包括Rogers廣泛使用的商業級RO3000和RO4000層壓板。更多信息請訪問該公司網站www.rogerscorp/acm.

Rogers Corporation (NYSE:ROG ), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance specialty material products for a variety of applications in a wide range of markets including: portable communications, consumer products, communication infrastructure, ground transportation, and aerospace and defense. Most of the Company's products are covered by trade secrets or patents.

Rogers operates manufacturing facilities in Arizona, Connecticut, and Illinois in the U.S., in Gent, Belgium and in Suzhou, China.

Asian sales offices are located in Japan, China, Taiwan, Korea, India and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics Co., Ltd. and in the U.S. with Mitsui Chemicals, Inc. The world runs better with Rogers.