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定價: | ¥ 36 | ||
作者: | (美)海爾萊曼(Hierle-mann,A.) 編著 | ||
出版: | 科學(xué)出版社 | ||
書號: | 9787030182388 | ||
語言: | 簡體中文 | ||
日期: | 2007-01-01 | ||
版次: | 1 | 頁數(shù): | 229 |
開本: | 16開 | 查看: | 0次 |

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本書涵蓋了CMOS化學(xué)微傳感系統(tǒng)的各個領(lǐng)域,詳細(xì)論述了化學(xué)微傳感器在CMOS中的集成技術(shù)。在做了簡要介紹之后,闡述了所有必備的基礎(chǔ)知識,介紹了各種化學(xué)敏感方法,并介紹了CMOS技術(shù)及其在微、傳感器中的應(yīng)用,最后對未來的發(fā)展作出了展望。
本書內(nèi)容豐富,涵蓋了大量的基礎(chǔ)知識及CMOS技術(shù)中化學(xué)微傳感器的相關(guān)重要信息,適合希望從事此領(lǐng)域工作的學(xué)生、工程技術(shù)人員、科學(xué)家閱讀,對于熟悉本領(lǐng)域的專家也很有參考價值。
本書內(nèi)容豐富,涵蓋了大量的基礎(chǔ)知識及CMOS技術(shù)中化學(xué)微傳感器的相關(guān)重要信息,適合希望從事此領(lǐng)域工作的學(xué)生、工程技術(shù)人員、科學(xué)家閱讀,對于熟悉本領(lǐng)域的專家也很有參考價值。
Preface
1 Introduction
2 Fundamentals of Chemical Sensing
3 Microtechnology for Chemical Sensors
3.1 Microtechnology Substrate Materials
3.2 Fundamental Semiconductor Processing Steps
3.2.1 Deposition
3.2.2 Patterning
3.2.3 Etching
3.2.4 Doping.
3.3 CMOS Technology
3.4 Microfabrication for Chemical Sensors
3.4.1 Micromachining for Chemical Microsensors
3.4.2 Wafer Bonding
3.4.3 Sensitive-Layer Deposition
4 Microfabricated Chemical Sensors
4.1 Chemomechanical Sensors
4.1.1 Rayleigh SAW Devices
4.1.2 Flexural-Plate-Wave or Lamb-Wave Devices
4.1.3 Resonating Cantilevers
4.2 Thermal Sensors
4.2.1 Catalytic Thermal Sensors (Pellistors)
4.2.2 Thermoelectric or Seebeck-Effect Sensors
4.3 Optical Sensors
4.3.1 Integrated Optics
4.3.2 Microspectrometers
4.3.2.1 Fabry-Perot-Type Structures
4.3.2.2 Grating-Type Structures
4.3.3 Bioluminescent Bioreporter Integrated Circuits (BBIC)
4.3.4 Surface Plasmon Resonance (SPR) Devices
4.4 Electrochemical Sensors
4.4.1 Voltammetric Sensors
4.4.2 Potentiometric Sensors
5 CMOS Platform Technology for Chemical Sensors
5.1 CMOS Capacitive Microsystems
5.1.1 CMOS Capacitive Transducer
5.1.2 On-Chip Circuitry of the Capacitive Microsystem
5.1.3 Capacitive Gas Sensing
5.2 CMOS Calorimetric Device
5.2.1 CMOS Calorimetric Transducer
5.2.2 Calorimeter Circuitry
5.2.3 Calorimetric Gas Sensing
5.3 CMOS Integrated Resonant Cantilever
5.3.1 Resonant Cantilever Transducers
5.3.2 Microcantilever Circuitry
5.3.3 Microcantilevers as Chemical Sensors
5.3.4 Comparison of Cantilevers to Other Mass-Sensitive Devices
5.4 CMOS Microhotplate System Development
5.4.1 CMOS Microhotplates
5.4.2 Hotplate-Based CMOS Monolithic Microsystems
5.5 CMOS Chemical Multisensor Systems
5.5.1 CMOS Multiparameter Biochemical Microsystem
5.5.2 CMOS Gas-Phase Multisensor System
5.6 CMOS Chemical Microsensor and System Packaging
5.6.1 Simple Epoxy-Based Package
5.6.2 Chip-on-Board Package
5.6.3 Flip-Chip Package ,
6 Outlook and Future Developments
References
Abbreviations
Index
1 Introduction
2 Fundamentals of Chemical Sensing
3 Microtechnology for Chemical Sensors
3.1 Microtechnology Substrate Materials
3.2 Fundamental Semiconductor Processing Steps
3.2.1 Deposition
3.2.2 Patterning
3.2.3 Etching
3.2.4 Doping.
3.3 CMOS Technology
3.4 Microfabrication for Chemical Sensors
3.4.1 Micromachining for Chemical Microsensors
3.4.2 Wafer Bonding
3.4.3 Sensitive-Layer Deposition
4 Microfabricated Chemical Sensors
4.1 Chemomechanical Sensors
4.1.1 Rayleigh SAW Devices
4.1.2 Flexural-Plate-Wave or Lamb-Wave Devices
4.1.3 Resonating Cantilevers
4.2 Thermal Sensors
4.2.1 Catalytic Thermal Sensors (Pellistors)
4.2.2 Thermoelectric or Seebeck-Effect Sensors
4.3 Optical Sensors
4.3.1 Integrated Optics
4.3.2 Microspectrometers
4.3.2.1 Fabry-Perot-Type Structures
4.3.2.2 Grating-Type Structures
4.3.3 Bioluminescent Bioreporter Integrated Circuits (BBIC)
4.3.4 Surface Plasmon Resonance (SPR) Devices
4.4 Electrochemical Sensors
4.4.1 Voltammetric Sensors
4.4.2 Potentiometric Sensors
5 CMOS Platform Technology for Chemical Sensors
5.1 CMOS Capacitive Microsystems
5.1.1 CMOS Capacitive Transducer
5.1.2 On-Chip Circuitry of the Capacitive Microsystem
5.1.3 Capacitive Gas Sensing
5.2 CMOS Calorimetric Device
5.2.1 CMOS Calorimetric Transducer
5.2.2 Calorimeter Circuitry
5.2.3 Calorimetric Gas Sensing
5.3 CMOS Integrated Resonant Cantilever
5.3.1 Resonant Cantilever Transducers
5.3.2 Microcantilever Circuitry
5.3.3 Microcantilevers as Chemical Sensors
5.3.4 Comparison of Cantilevers to Other Mass-Sensitive Devices
5.4 CMOS Microhotplate System Development
5.4.1 CMOS Microhotplates
5.4.2 Hotplate-Based CMOS Monolithic Microsystems
5.5 CMOS Chemical Multisensor Systems
5.5.1 CMOS Multiparameter Biochemical Microsystem
5.5.2 CMOS Gas-Phase Multisensor System
5.6 CMOS Chemical Microsensor and System Packaging
5.6.1 Simple Epoxy-Based Package
5.6.2 Chip-on-Board Package
5.6.3 Flip-Chip Package ,
6 Outlook and Future Developments
References
Abbreviations
Index